The difference between red glue steel net and paste net

 First, I believe that many customers in my division after doing steel plate, steel network, when the steel network, I do not know how to choose, and today to do a simple share with everyone! The 1. is mainly on the steel net technology selection: component design general chip processing manufacturers will root PCB board, to decide whether to do the solder paste stencil or red plastic steel mesh, general plug more, to soldering, use red plastic net technology. There are not many plug-in components, but wave soldering. With artificial welding, the use of solder paste network technology, of course, this must be based on the customer to determine the production of smt. 2., steel network difference: red glue Net - first print red glue, and then put on components, and other components and PCB stick stability, plug in components, unified wave soldering. Solder paste Net - directly pastes solder paste on the pad, pastes on the patch element, unified reflow soldering, plug-in components manual welding. 3. of course, there is a fundamental difference, simple to understand, is opening in different ways: red plastic net, such as a resistor, the normal 2 pads, the red glue hole is positioned between the pads, so brush red glue stick, tin. The disk position is opened so that the solder paste is brushed directly on the pad position. Two, red glue and paste red gum is a thin poly compound, and the solder is different after heat curing, the freezing point temperature of 150 DEG C, then, starting from the red glue paste directly into a solid. The properties of red glue: red glue with viscosity temperature characteristics, liquidity, profit the characteristics of moisture. According to the characteristics of red gum, so in production, the purpose is to make use of red plastic parts are firmly pasted on the surface of PCB to prevent it from falling paste (Solder paste) SMT is a indispensable material, after it cooked after being melted, the SMT parts are welded in PCB copper foil, connected and conductive function. It acts like a tin wire and wave soldering we often see with tin water, but their inherent state of different 1). From the point of view of Technology: using red glue dispensing process, when the board points, will become the bottleneck of the whole SMT dispensing line; The red glue glue printing process, requirements of the first AI patch, and the glue printing position is accurate; the paste process requires a furnace bracket; 2). From the perspective of quality: - Part red gum on the cylinder or vitreous body package, easy to fall; compared with solder paste, red rubber under storage conditions more influence moisture, problems also fall; compared with solder paste, red plastic in non-performing rate will be higher after soldering, typical problems include leakage welding; 3). From the manufacturing cost: a furnace bracket in the process of solder paste is larger for investment; on the joints, solder paste, tin ratio Ba GUI; glue is unique red glue in the process of cost; 4). From the use of: - red glue should be put in the refrigerator 2~8 degrees of preservation, prevent due to temperature changes, impact properties. 3) red glue back temperature at room temperature for 4 hours, by the use of FIFO order. 4) For dispensing operation, red glue hose to the deaeration, red glue for one-time unused should be put back into the refrigerator, the old and new glue glue do not mix. 5) to accurately fill out the temperature record, people back to temperature and return temperature time, users need to confirm the temperature OK before use. Usually, it red gum can not use expired, but there is a solder oxidation phenomenon immediately rejected. The paste can be stored at room temperature for 30 days at 2~8 DEG C can store 120 days. (Solder: paste) plus solder paste in printing machines. The components are: tin solder paste (63%), (37%), ceruse flux (total component 5%). Paste the eutectic point of 183 DEG C, then paste paste by melting. The cold into the solid body. Its function is to heat the solder paste is abnormal, medium and PCB PAD welding parts.